| Main Capabilities 主要能力指标 | Line-card | Back Plane | HDI |
| Layer Count 层数 | 2-38 | 2-56 | 4-28 |
| PCB Thickness PCB板厚(mm) | 0.4-5.0 | 1.0-7.0 | 0.4-4.0 |
| MAX PCB Size 最大完成PCB尺寸 (mm×mm) | 575×900 | 575×1085 | 610×475 |
| Inner Layer Copper Thickness 内层底铜厚度(OZ/ft2) | T-6 | H-6 | H-4 |
| Min core thickness 最小芯板厚度(mil) | 2 | 3 | 2 |
| Copper Plating Holes 孔壁铜厚(µm) | 20/18, 25/20, 50, 70 | 20/18, 25/20 | 15/13, 20/18, 25/20 |
| Outer Layer Copper Thickness 外层完成铜厚(µm) | 35, 70, 105, 140, 180 | 35, 70, 105, 140, 180 | 35, 70 |
| Base Material Performance 板材性能类别 | High-Tg, Low-Tg, Mid-Tg, Low-Dk, Mid-Df, Low-Df, RF, Halogen Free, Anti-CAF, Lead Free Compliance | High-Tg, Mid-Tg, Low-Dk, Mid-Df, Low-Df, Halogen Free, Anti-CAF, Lead Free Compliance | High-Tg, Low-Tg, Mid-Tg, Low-Dk, Mid-Df, Low-Df, Halogen Free, Anti-CAF, Lead Free Compliance |
| Inner Layer Min Line/Space 内层最小线宽/间距 (mil) | 2.5/3.0 | 3.0/3.5 | 2.5/3.0 |
| Outer Layer Min Line/Space 外层最小线宽/间距(mil) | 3.0/3.0 | 4.0/4.5 | 2.5/3.0 |
| Min Drill hole diameter 最小钻孔孔径(机械钻) (mm) | 0.15 | 0.25 | 0.15 |
| Aspect Ratio of PTH(Max) PTH孔纵横比(最大) | 20:1 | 20:1 | 15:1 |
| Surfaces treatment 表面处理方式 | HAL, OSP, Immertion Tin, Immertion Ag, ENIG, ENIG+OSP, Plated Ni/Au | HAL, OSP, Immertion Tin, ENIG | OSP, Immertion Ag, ENIG, ENIG+OSP |
| Max HDI structure HDI板最大阶数 | / | / | 2+N+2 |
| Special Design Type 特殊设计 | 埋入类PCB, 阶梯类PCB, 金属散热类PCB, 高密PCB, 微波类PCB, 精细线路PCB, 局部混压工艺等 | Dual-via大小孔板(18mil/16mil, 7mm厚, 40层), Z向连接技术(11mm厚, 58层), PI压合背板 | 二阶深微孔系统板(AR=0.8, POFV+Back Drill) |
| High-Speed Base Material 高速板材 | M4, N4000-13系列, TU872SLK(SP), EM828, S7439, FR408HR IS, I-speed, FR408, FR408HR, EM-888, TU-882, S7038, HE-679G(S), TU-875S, NY6200S等 | M4, N4000-13系列, TU872SLK(SP), EM828, S7439, FR408HR IS, I-speed, FR408, FR408HR, EM-888, TU-882, S7038, HE-679G(S), TU-875S, NY6200S等 | M6, FR408HR, R04350B, TU872SLK(SP)等 |
| High-Frequency Base Material 高频板材 | M6, FX2, FL700(LD), RO4350B, RF35(A2), S7338, S7136, TU-882, N4800-20(SI), IT-150DA, RO3003, RO3006等 | M6, FX2, FL700(LD), S7338, S7136, TU-882, N4800-20(SI), IT-150DA, 等 | |
| Lead-Free Base Material 无铅板材 | S000H, S1000-2, S1190, S1170, R1755V, E-679FJ, E-679W, IT180A, T180I, TU768, EM827, 370HR等 | S000H, S1000-2, S1190, S1170, R1755V, E-679FJ, E-679W, IT180A, T180I, TU768, EM827, 370HR等 | S000H, S1000-2, S1190, S1170, R1755V, E-679FJ, E-679W, IT180A, T180I, TU768, EM827, 370HR等 |
| Halogen-Free Base Material 无卤板材 | TU862HF, R-1566W, MCL-HE-679G, EM285, MCL-BE-67G(H)， EM370D, BE-67G(S), BE-67G(R), NPGN-150TL, P-175FM, S1165G, IT-170GRA, M2等 | TU862HF, R-1566W, MCL-HE-679G, EM285, MCL-BE-67G(H), EM370D, BE-67G(S), BE-67G(R), NPGN-150TL, P-175FM, S1165G, IT-170GRA, M2等 | TU862HF, R-1566W, MCL-HE-679G, EM285, MCL-BE-67G(H)， EM370D, BE-67G(S), BE-67G(R), NPGN-150TL, P-175FM, S1165G, IT-170GRA, M2等 |
| Embedded Type PCB 埋入类PCB | 埋容板(C-Ply， BC12TM), 埋阻板(Ohmega-Ply, TU-XX-08), 埋子板(双面, 多层), 埋磁芯(C型, O型) | / | 埋容板(C-Ply， BC12TM) |
| Cavity Type PCB 阶梯类PCB | PTH阶梯槽板, NPTH阶梯槽板, 阶梯位金手指板, 槽底图形的阶梯槽板 | / | / |
| Metal Heat-Output Type PCB 金属散热类PCB | 压合金属基板, 焊接金属基板, 埋铜块板, 嵌铜块板 | / | 埋铜块板, 嵌铜块板 |
| High Density Type PCB 高密PCB | 1mmpitch BGA背钻内层走2线 8mil过孔背钻板(D+6mil) 二阶深微孔系统板(AR=1.0) 0.65mm pitch BGA系统板 | / | 二阶深微孔系统板(AR=0.8) 0.65mm pitch BGA系统板 |
| Fine Line PCB 精细线路PCB | 外层线宽精度为±1.0mil 内层线宽精度为±0.5mil | / | 外层线宽精度为±1.0mil 内层线宽精度为±0.5mil, |
| MicroWave PCB 微波类PCB | “微波沉银/沉金”的ODU, PTFE射频. | / | “微波沉银/沉金”的ODU, PTFE射频. |
| Partial Hybrid Lamination TECH 局部混压工艺 | PCB局部区域"嵌入双面≥0.5mm厚度的高频板材对应2层或4层FR4" | / | / |